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Vacuum etching machien is a process used in printed circuit board (PCB) manufacturing, which is mainly used to remove unwanted parts of the copper foil layer to form lines, contacts and electrical connections. The role of vacuum etching in PCB manufacturing is to precisely remove excess metal to preserve the wiring and pattern of the circuit design.
Coating and exposure of copper foil layer: First, a layer of photosensitive resist is coated on the PCB substrate, and then the designed circuit pattern is transferred to the resist using ultraviolet exposure technology.
Developing and protection: The post-exposure resist is developed to expose the copper foil surface of the circuit board.
Vacuum etching: In a vacuum environment, the PCB is immersed in the etching liquid, which is usually composed of ferric chloride, copper chloride and other components. The etching liquid is in contact with the copper surface in a vacuum state, and the copper that is not protected by the resist is removed to form the circuit board.
Post-treatment: After etching, clean the circuit board, remove the residual resist and etching liquid, and complete the formation of the line pattern.
Loader→ vacuum etching 1→vacuum etching→2vacuum etching 3→unloader
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