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PCB etching equipment is a key device used to remove copper foil to form circuit patterns in the process of manufacturing printed circuit boards (PCBS). Etching is an important process step in PCB production, which removes unwanted copper layers from the circuit board through a chemical reaction, leaving the desired circuit pattern.
According to different etching methods and technologies, circuit board etching equipment can be divided into the following types: Spray Etching, Immersion Etching, Roller Etching, Laser Etching.
Composition of etching fluids. Common etching fluids include ferric chloride (FeCl), copper sulfate (CuSO₄), and tin chloride (SnCl₂). Different etching fluids are suitable for different materials and requirements.
Temperature control: The temperature of the etching fluid has a significant impact on the etching speed and effect, and usually needs to be maintained within a stable temperature range.
Etching time: Depending on the thickness of the copper layer, the concentration of the etching solution, and the area of the board, the etching time needs to be precisely controlled.
Etching accuracy: The requirements for small pitch and high density circuits require equipment with high precision control capabilities.
Loader→ Precision etching→ Overflow washing (1)(2)(3)(4)→Water washing/drying →unloader
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