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OSP line (OSP: Organic Solderability Preservative) is a surface treatment technology used in PCB manufacturing. OSP is a mechanical solder shield that is commonly used to protect the copper surface of a Printed Circuit Board (PCB) from oxidation and corrosion while maintaining weldability.
Compared with other surface treatment methods (such as gold, silver, tin plating, etc.), OSP treatment has the following characteristics:
Copper surface protection: The OSP coating can effectively prevent copper oxidation during transportation, storage and processing, and maintain its weldability.
Environmental protection: Compared with the traditional electroless nickel plating process, OSP is more environmentally friendly and does not contain harmful heavy metals.
Low cost: OSP processing costs are relatively low, making it a cost-effective option for mass-produced PCB.
Strong applicability: Especially suitable for low-cost electronic products requiring good weldability, such as consumer electronics, home appliances, etc.
Weldability: Despite the strong protection, OSP coatings have limited durability and may not be suitable for high frequency or high performance PCB
OSP coating is generally coated on the copper surface of the PCB by soaking, spraying, etc., to form a thin and uniform organic protective film, usually colorless or light green, when welding, the OSP coating will burn off under heating, exposing the copper surface, allowing the welding material to have good contact with the copper.
Loader → oil removal → overflow washing (1) (2) → clean water entry → slight corrosion → overflow washing (3) (4) strong wind →Oxidation resistance → washing with overflow water (5) (6) (7) →washing with water → dry board combination → unloader
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