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In the production process of printed circuit board (PCB), DES (Developing, Etching, and Stripping) production lines are three key process steps, namely developing, etching, and stripping.
Developing is a process used in PCB manufacturing to remove the exposed areas on the photosensitive adhesive (photoresist) after photolithography. After exposure, the chemical structure of the photosensitive adhesive changes, and the exposed area becomes more soluble. During the development process, a specific developer or solvent is used to remove the photoresist from the exposed area, leaving the unexposed area as the basis for the circuit pattern.
Etching process is a process used to remove unwanted parts of the copper layer of the PCB after development. In this step, the exposed part of the copper layer (the area not protected by the photoresist) is dissolved by a chemical etching solution (such as ferric chloride, copper sulfate, etc.) to form the final circuit pattern. After etching, the remaining copper foil part is the copper wire that forms the circuit board.
Stripping is the process of removing the photoresist film. After etching, the photoresist is still attached to the surface of the copper wire, and the stripping process removes the photoresist completely through solvents or chemical liquids. In this way, the circuit pattern on the circuit board is clearly preserved to prepare for subsequent welding, drilling and other processes.
Board entry→ Precision etching→ Overflow washing (1)(2)(3)(4) →Water washing /drying→ Exit board
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