OKI Circuit Technology (hereinafter referred to as OTC), a printed circuit board (PCB) specialist under the OKI Group, has successfully developed “convex copper embedded high layer PCB technology” (hereinafter referred to as convex copper coin) that achieves 55 times heat dissipation. Convex copper coin technology offers both round and rectangular options, depending on the shape of the electronic components installed on the PCB. OTC is committed to bringing this new technology PCB product to those small devices and space markets that cannot use air cooling technology, and is actively promoting the development of mass production technology.

With the continuous progress of semiconductor technology, the trend of miniaturization and high performance is obvious, which leads to the heat dissipation problem of processing high-speed and large-capacity data. In the case that the device size is limited, cooling fans and radiators cannot be installed, or air cooling technology cannot be used in vacuum environments such as space, the heat generated by electronic components needs to be transferred to external structures such as the housing through the PCB to achieve a “high-efficiency heat conduction cooling structure.” As early as 2015, OTC has successfully embedded copper (copper coins) with high thermal conductivity in a cylindrical shape into the through-hole of the PCB, and achieved heat dissipation to the back of the PCB substrate through direct contact with the heating electronic components. This autonomous technology, called “Copper embedded High Multilayer PCB”, has achieved a breakthrough in design and mass production technology. In cases where it is not possible to install heat dissipation devices directly on electronic components, such as image sensors and light-emitting elements, efficient heat dissipation is achieved by using copper coins on the back of the PCB for heat conduction. Today, the technology has once again made a breakthrough, developing a “convex copper coin” that increases the heat dissipation efficiency by about 2 times.

The newly developed convex copper coin technology improves the heat transfer efficiency by increasing the heat dissipation area of the contact surface with the heating electronic component. In order to further optimize the heat dissipation effect to adapt to the shape of different electronic components, the convex copper coin technology improves the heat dissipation performance by increasing the contact area with the rectangular electronic components and the area of the cooling part. On the basis of the original circular product, a new product with rectangular ground and cooling surface has been developed. Both types of products can be customized according to the installed electronic components and the shape and thickness of the PCB to form an optimal heat dissipation structure. The convex copper coins technology can effectively transfer the heat generated by the electronic components on the PCB to the outside of the shell and emit it in the environment where air cooling technology cannot be used, such as small devices and space.